by: DCEM
Polygon: use Rank to draw polygons into each ohter
Thermal Pads: Use thermal symbol connected to GND request level swap use one SMD Pad (TP0) for the surface area use as much Pads (TP1 - TPX) as needed for heat transfer
qfn packages (or othes small pitch packages) : use smd pads with roundness 100% (round edges are better for solder paste release)
Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
by: DCEM
Description:
<h1>PART_NAME</h1>
SHORT_DESCRIPTION
<h2>Links</h2>
<ul>
<li>
<a href="HTTPS_LINK">Datasheet</a><br>
</li>
<li>
<a href="HTTPS_LINK">Product website</a><br>
</li>
</ul>
Keepout
OC_MOUSER
Silk Screen
PCB-Pool: (t/b)Place and (t/b)Names will be printed
minimum font size: 0,6mm (acceptable readability) - 0,8mm (good readability)
keywords:
land pattern, footprint