PCB-Design: Eagle Library: Unterschied zwischen den Versionen

Version vom 4. Januar 2018, 11:01 Uhr

by: DCEM

Polygon: use Rank to draw polygons into each ohter

Thermal Pads: Use thermal symbol connected to GND request level swap use one SMD Pad (TP0) for the surface area use as much Pads (TP1 - TPX) as needed for heat transfer

qfn packages (or othes small pitch packages) : use smd pads with roundness 100% (round edges are better for solder paste release)

Additional Information regarding PCB-Design. This is a work in progress and will hopefully be updated. by: DCEM

Description:

<h1>PART_NAME</h1>
SHORT_DESCRIPTION
<h2>Links</h2>
<ul>
   <li>
      <a href="HTTPS_LINK">Datasheet</a><br>
   </li>
   <li>
      <a href="HTTPS_LINK">Product website</a><br>
   </li>
</ul>

Keepout

OC_MOUSER

Silk Screen

PCB-Pool: (t/b)Place and (t/b)Names will be printed

minimum font size: 0,6mm (acceptable readability) - 0,8mm (good readability)

keywords: land pattern, footprint