PCB-Design: Eagle Library: Unterschied zwischen den Versionen
Aus Hackerspace Ffm
DCEM (Diskussion | Beiträge) |
DCEM (Diskussion | Beiträge) |
||
| Zeile 1: | Zeile 1: | ||
| + | by: [[Benutzer:DCEM|DCEM]] | ||
| + | |||
| + | Thermal Pads: | ||
| + | Use thermal symbol connected to GND request level swap | ||
| + | use one SMD Pad (TP0) for the surface area | ||
| + | use as much Pads (TP1 - TPX) as needed for heat transfer | ||
| + | |||
| + | qfn packages (or othes small pitch packages) : | ||
| + | use smd pads with roundness 100% (round edges are better for solder paste release) | ||
| + | |||
| + | |||
Additional Information regarding PCB-Design. | Additional Information regarding PCB-Design. | ||
This is a work in progress and will hopefully be updated. | This is a work in progress and will hopefully be updated. | ||
Version vom 28. Dezember 2017, 12:41 Uhr
by: DCEM
Thermal Pads: Use thermal symbol connected to GND request level swap use one SMD Pad (TP0) for the surface area use as much Pads (TP1 - TPX) as needed for heat transfer
qfn packages (or othes small pitch packages) : use smd pads with roundness 100% (round edges are better for solder paste release)
Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
by: DCEM
Description:
<h1>PART_NAME</h1>
SHORT_DESCRIPTION
<h2>Links</h2>
<ul>
<li>
<a href="HTTPS_LINK">Datasheet</a><br>
</li>
<li>
<a href="HTTPS_LINK">Product website</a><br>
</li>
</ul>
Keepout
OC_MOUSER
Silk Screen
PCB-Pool: (t/b)Place and (t/b)Names will be printed
minimum font size: 0,6mm (acceptable readability) - 0,8mm (good readability)
