PCB-Design: Eagle Library: Unterschied zwischen den Versionen
Aus Hackerspace Ffm
DCEM (Diskussion | Beiträge) |
DCEM (Diskussion | Beiträge) |
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(23 dazwischenliegende Versionen desselben Benutzers werden nicht angezeigt) | |||
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+ | by: [[Benutzer:DCEM|DCEM]] | ||
+ | |||
+ | Prefix: | ||
+ | [https://en.wikipedia.org/wiki/Reference_designator Wikipedia: Reference designator] | ||
+ | |||
+ | Polygon: | ||
+ | use Rank to draw polygons into each ohter | ||
+ | |||
+ | Thermal Pads: | ||
+ | Use thermal symbol connected to GND request level swap | ||
+ | use one SMD Pad (TP0) for the surface area | ||
+ | use as much Pads (TP1 - TPX) as needed for heat transfer | ||
+ | |||
+ | qfn packages (or othes small pitch packages) : | ||
+ | use smd pads with roundness 100% (round edges are better for solder paste release) | ||
+ | |||
+ | |||
Additional Information regarding PCB-Design. | Additional Information regarding PCB-Design. | ||
This is a work in progress and will hopefully be updated. | This is a work in progress and will hopefully be updated. | ||
Zeile 4: | Zeile 21: | ||
Description: | Description: | ||
− | < | + | <nowiki><h1>PART_NAME</h1> |
− | <h1>PART_NAME</h1> | + | |
SHORT_DESCRIPTION | SHORT_DESCRIPTION | ||
<h2>Links</h2> | <h2>Links</h2> | ||
Zeile 15: | Zeile 31: | ||
<a href="HTTPS_LINK">Product website</a><br> | <a href="HTTPS_LINK">Product website</a><br> | ||
</li> | </li> | ||
− | </ul> | + | </ul></nowiki> |
− | < | + | |
+ | |||
+ | |||
+ | |||
Zeile 30: | Zeile 49: | ||
minimum font size: | minimum font size: | ||
0,6mm (acceptable readability) - 0,8mm (good readability) | 0,6mm (acceptable readability) - 0,8mm (good readability) | ||
+ | |||
+ | |||
+ | keywords: | ||
+ | land pattern, footprint | ||
[[Kategorie:Projekte]] | [[Kategorie:Projekte]] |
Version vom 31. Mai 2018, 12:01 Uhr
by: DCEM
Prefix: Wikipedia: Reference designator
Polygon: use Rank to draw polygons into each ohter
Thermal Pads: Use thermal symbol connected to GND request level swap use one SMD Pad (TP0) for the surface area use as much Pads (TP1 - TPX) as needed for heat transfer
qfn packages (or othes small pitch packages) : use smd pads with roundness 100% (round edges are better for solder paste release)
Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
by: DCEM
Description:
<h1>PART_NAME</h1> SHORT_DESCRIPTION <h2>Links</h2> <ul> <li> <a href="HTTPS_LINK">Datasheet</a><br> </li> <li> <a href="HTTPS_LINK">Product website</a><br> </li> </ul>
Keepout
OC_MOUSER
Silk Screen
PCB-Pool: (t/b)Place and (t/b)Names will be printed
minimum font size: 0,6mm (acceptable readability) - 0,8mm (good readability)
keywords:
land pattern, footprint