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DCEM (Diskussion | Beiträge) (Die Seite wurde neu angelegt: „Additional Information regarding PCB-Design. This is a work in progress and will hopefully be updated. by: DCEM == Silk Screen == minimum f…“) |
DCEM (Diskussion | Beiträge) |
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| + | by: [[Benutzer:DCEM|DCEM]] | ||
| + | |||
| + | Polygon: | ||
| + | use Rank to draw polygons into each ohter | ||
| + | |||
| + | Thermal Pads: | ||
| + | Use thermal symbol connected to GND request level swap | ||
| + | use one SMD Pad (TP0) for the surface area | ||
| + | use as much Pads (TP1 - TPX) as needed for heat transfer | ||
| + | |||
| + | qfn packages (or othes small pitch packages) : | ||
| + | use smd pads with roundness 100% (round edges are better for solder paste release) | ||
| + | |||
| + | |||
Additional Information regarding PCB-Design. | Additional Information regarding PCB-Design. | ||
This is a work in progress and will hopefully be updated. | This is a work in progress and will hopefully be updated. | ||
by: [[Benutzer:DCEM|DCEM]] | by: [[Benutzer:DCEM|DCEM]] | ||
| + | |||
| + | Description: | ||
| + | <nowiki><h1>PART_NAME</h1> | ||
| + | SHORT_DESCRIPTION | ||
| + | <h2>Links</h2> | ||
| + | <ul> | ||
| + | <li> | ||
| + | <a href="HTTPS_LINK">Datasheet</a><br> | ||
| + | </li> | ||
| + | <li> | ||
| + | <a href="HTTPS_LINK">Product website</a><br> | ||
| + | </li> | ||
| + | </ul></nowiki> | ||
| + | |||
| + | |||
| + | |||
| + | |||
| + | |||
| + | |||
| + | Keepout | ||
| + | |||
| + | OC_MOUSER | ||
== Silk Screen == | == Silk Screen == | ||
| + | |||
| + | PCB-Pool: | ||
| + | (t/b)Place and (t/b)Names will be printed | ||
minimum font size: | minimum font size: | ||
| − | 0,6mm - 0,8mm | + | 0,6mm (acceptable readability) - 0,8mm (good readability) |
| + | |||
| + | |||
| + | keywords: | ||
| + | land pattern, footprint | ||
[[Kategorie:Projekte]] | [[Kategorie:Projekte]] | ||
Version vom 4. Januar 2018, 11:01 Uhr
by: DCEM
Polygon: use Rank to draw polygons into each ohter
Thermal Pads: Use thermal symbol connected to GND request level swap use one SMD Pad (TP0) for the surface area use as much Pads (TP1 - TPX) as needed for heat transfer
qfn packages (or othes small pitch packages) : use smd pads with roundness 100% (round edges are better for solder paste release)
Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
by: DCEM
Description:
<h1>PART_NAME</h1>
SHORT_DESCRIPTION
<h2>Links</h2>
<ul>
<li>
<a href="HTTPS_LINK">Datasheet</a><br>
</li>
<li>
<a href="HTTPS_LINK">Product website</a><br>
</li>
</ul>
Keepout
OC_MOUSER
Silk Screen
PCB-Pool: (t/b)Place and (t/b)Names will be printed
minimum font size: 0,6mm (acceptable readability) - 0,8mm (good readability)
keywords:
land pattern, footprint
